Based on the experience of more than two million inverters already produced, Laing Innotech produces electronic boards for their customers. These can be assemblies that have been developed by Laing Innotech or assemblies based on your sample board or from your full set of documentation.

From the simple through hole PCBs to assemblies with several boards and surface mount components, we are sure that we can offer a suitable solution for all your requirements.

After the placement of the components, each assembly will be tested. We can also load firmware or parameters as required. If desired, we can provide a test log for every assembly.

The placement of the components is made by SMD production lines with automatic optical alignment of the components. Wired components will be placed by machines if the volume and the complexity of the components allow for it. If not, such components will be placed manually.

Soldering is done by a reflow process, the wired components will be wave soldered, selectively soldered or manually soldered. Only lead free processes are used.

For SMD placement components from 0402 up to high pin number. Fine pitch components and ball- grid arrays can be handled.

Wired components will be placed manually or automatically based on the complexity of the part and on the volume.

Our development department is able to support our customers in any phase of the project.

From the preparation of production documentation, based on a layout to a complete new design of a board. All steps from the initial idea to the final product can be performed by our team.

From visual inspection up to AOI we can offer all common inspection methods. Dependent on the complexity and the volume of the product, we use simple test equipment, all the way up to fully automated test stands to perform all required and desired test operations.

Throughout the testing process, we can program processors and enter calibration parameters into the system, based on actual measured values. Throughout the final testing phase, we can also pair transceiver assemblies and assign individual addresses.

All test procedures will be logged. If desired, individual serial numbers can be attached to the subassemblies providing traceability for all measured values on the assembly.

We are happy to source PCB’s, electronic and electromechanical components. For smaller quantities we use our distributors. For medium to larger volume, we recommend sourcing through our well established contacts in China, Taiwan and India.